Concepedia

Stability of Flip-Chip Interconnects Assembled with Al/Ni(V)/Cu-UBM and Eutectic Pb-Sn Solder During Exposure to High-Temperature Storage

John Osenbach, A. Amin, M. Bachman, F. A. Baiocchi, D. Bitting, D. L. Crouthamel, J. M. DeLucca, D. Gerlach, J. Goodell, C. Peridier,

Journal of Electronic Materials · 2008 · 13 citations · 19 references

DOI

Concepts

References

19

Electromigration—A brief survey and some recent results

J. R. Black · IEEE Transactions on Electron Devices · 1969 · 1.5K citations

, , +17

Six cases of reliability study of Pb-free solder joints in electronic packaging technology

Ke Zeng, K. N. Tu · Materials Science and Engineering R Reports · 2002 · 1.4K citations

, , +15

Effects of intermetallic compounds on properties of Sn–Ag–Cu lead-free soldered joints

K.S. Kim, Seok‐Hwan Huh, Katsuaki Suganuma · Journal of Alloys and Compounds · 2003 · 610 citations

, , +11

Controlled Collapse Reflow Chip Joining

Lincoln Miller · IBM Journal of Research and Development · 1969 · 364 citations

, , +14

Effect of Cu concentration on the reactions between Sn-Ag-Cu solders and Ni

Cheng–En Ho, Rung‐Ywan Tsai, Y. L. Lin et al. · Journal of Electronic Materials · 2002 · 325 citations

, , +13