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Stability of Flip-Chip Interconnects Assembled with Al/Ni(V)/Cu-UBM and Eutectic Pb-Sn Solder During Exposure to High-Temperature Storage

Materials EngineeringMaterials ScienceElectrical Engineering3D Ic ArchitectureEngineeringAdvanced Packaging (Semiconductors)Chip On BoardApplied PhysicsChip AttachmentEutectic Pb-sn SolderElectronic PackagingFlip-chip Interconnects AssembledMicroelectronicsInterconnect (Integrated Circuits)High-temperature Storage