Concepedia
Statistics
Publications
2
Citations
47
H-Index
Active since
2003
Affiliations
Singapore Science Park(Current)
Institute of Microelectronics
B. Njoman is an author at Singapore Science Park specializing in electronic packaging, advanced packaging, and engineering.
Top concepts
EngineeringMaterial ScienceAdvanced PackagingElectronic PackagingMechanical EngineeringFood PackagingFailure AnalysisReliability Engineering
Publications per year
2003–2003
The impact of moisture in mold compound preforms on the warpage of PBGA packages
T.Y. Lin, B. Njoman, D. L. Crouthamel et al. · Microelectronics Reliability · 2003 · 28 citations
Advanced Packaging, Materials Science, Food Packaging +7
Failure Analysis of Full Delamination on the Stacked Die Leaded Packages
T.Y. Lin, Z.P. Xiong, Yasuhiro Yao et al. · Journal of Electronic Packaging · 2003 · 19 citations
Engineering, Mechanical Engineering, Reliability Engineering +16
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