D. J. Boyle is an author at AT&T (United States) specializing in microstructure, electronic packaging, and materials science.
Top concepts
PlasticityEngineeringMicrostructureSolid MechanicsMaterial ScienceAdvanced PackagingThermal EngineeringElectronic PackagingMechanical PropertiesMechanical Engineering
Publications per year
1990–1990
1
1
Thermomechanical properties of 1C molding compounds
H. E. Bair, D. J. Boyle, Jason T. Ryan et al. · Polymer Engineering and Science · 1990 · 50 citations
Transfer Molding, Thermomechanical Properties, Engineering +18
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