Huang-Kuang Kung

Fatigue response of APC-2 composite laminates at elevated temperatures

Ming‐Hwa R. Jen, Yu-Chung Tseng, Huang-Kuang Kung et al. · Composites Part B Engineering · 2008 · 44 citations

Materials Science, Engineering, Composite Technology +4

A method to determine the sweep resistance of wire bonds for microelectronic packaging

Huang-Kuang Kung, Yun-Ping Sun, Jeng-Nan Lee et al. · Microelectronic Engineering · 2008 · 24 citations

Materials Science, Microelectronic Packaging, Electrical Engineering +12

High-temperature wire sweep characteristics of semiconductor package for variable loop-height wirebonding technology

Huang-Kuang Kung, Bo-Wun Huang · Microelectronic Engineering · 2005 · 21 citations

Electrical Engineering, Semiconductor Package, Engineering +8

Evaluation of sweep resistance of Q Auto-Loop and Square-Loop bonds for semiconductor packaging technology

Huang-Kuang Kung · Microelectronics Reliability · 2006 · 19 citations

Electrical Engineering, Chip-scale Package, Engineering +11

The wire sweep analysis based on the evaluation of the bending and twisting moments for semiconductor packaging

Huang-Kuang Kung, Jeng-Nan Lee, Chin‐Yu Wang · Microelectronic Engineering · 2006 · 17 citations

Advanced Packaging, Electrical Engineering, Wire Sweep Analysis +9