Concepedia

Jeng-Nan Lee

JL

Statistics

Publications

5

Citations

85

H-Index

5

Active since

2006

Affiliations

Cheng Shiu University(Current)

Jeng-Nan Lee is an author at Cheng Shiu University specializing in engineering, electronic packaging, and microelectronics.

Top concepts

EngineeringMicroelectronicsElectronic PackagingElectrical EngineeringRoboticsAutomationMechatronicsField RoboticsApplied PhysicsMaterial Science

Publications per year

2006–2023

5

Publications

5

A method to determine the sweep resistance of wire bonds for microelectronic packaging

Huang-Kuang Kung, Yun-Ping Sun, Jeng-Nan Lee et al. · Microelectronic Engineering · 2008 · 24 citations

Materials Science, Microelectronic Packaging, Electrical Engineering +12

The wire sweep analysis based on the evaluation of the bending and twisting moments for semiconductor packaging

Huang-Kuang Kung, Jeng-Nan Lee, Chin‐Yu Wang · Microelectronic Engineering · 2006 · 17 citations

Advanced Packaging, Electrical Engineering, Wire Sweep Analysis +9

Supercritical Carbon Dioxide Decellularized Xenograft-3D CAD/CAM Carved Bone Matrix Personalized for Human Bone Defect Repair

Meng‐Yen Chen, Jing‐Jing Fang, Jeng-Nan Lee et al. · Genes · 2022 · 16 citations · Full text

Design of a pipeline inspection robot with belt driven ridged cone shaped skate model

Fa‐Shian Chang, Lih‐Tyng Hwang, Chih-Feng Liu et al. · 2015 · 14 citations

Robot Kinematics, Skate Model, Engineering +14

Applying a Neural Network to Predict Surface Roughness and Machining Accuracy in the Milling of SUS304

Ming-Hsu Tsai, Jeng-Nan Lee, Hung-Da Tsai et al. · Electronics · 2023 · 14 citations · Full text

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