Lih‐Tyng Hwang

Thermal stress analysis of a multichip package design

Robert Darveaux, I. Turlik, Lih‐Tyng Hwang et al. · IEEE Transactions on Components Hybrids and Manufacturing Technology · 1989 · 46 citations

Engineering, Mechanical Engineering, Thermal Stress Analysis +18

Transmitarray Design With Enhanced Aperture Efficiency Using Small Frequency Selective Surface Cells and Discrete Jones Matrix Analysis

Chung-Yi Hsu, Lih‐Tyng Hwang, Tzyy‐Sheng Horng et al. · IEEE Transactions on Antennas and Propagation · 2018 · 44 citations

Wireless Communications, Four-layer Transmitarray Antenna, Horn Antenna +21

A thermal module design for advanced packaging

Lih‐Tyng Hwang, I. Turlik, Arnold Reisman · Journal of Electronic Materials · 1987 · 42 citations

Advanced Packaging, Chip-scale Package, Package Design +8

A ZigBee position technique for indoor localization based on proximity learning

Chung-Wei Ou, Chin‐Jung Chao, Fa‐Shian Chang et al. · 2017 · 32 citations

Engineering, Location Estimation, Positioning System +17

Parameterized models for a RF chip-to-substrate interconnect

I. Doerr, Lih‐Tyng Hwang, G. Sommer et al. · 2001 · 31 citations

Electrical Engineering, Physical Design (Electronics), Engineering +15