Concepedia

I. Turlik

IT

Statistics

Publications

25

Citations

613

H-Index

16

Active since

1987

Affiliations

MCNC Research and Development Institute(Current)

North Carolina State University

Research Triangle Park Foundation

University of North Carolina at Charlotte

Triangle

I. Turlik is an author at MCNC Research and Development Institute specializing in engineering, electronic packaging, and materials science.

Top concepts

EngineeringElectronic PackagingMaterial ScienceMicroelectronicsElectrical EngineeringHeat TransferApplied PhysicsThermal EngineeringThin FilmsAdvanced Packaging

Publications per year

1987–2005

25

Publications

25

Rapid thermal curing of BCB dielectric

P Garrou, R.H. Heistand, Mitchell G. Dibbs et al. · IEEE Transactions on Components Hybrids and Manufacturing Technology · 1993 · 66 citations

Engineering, Thermal Processing, Chemistry +20

Electroplated solder joints for flip-chip applications

E.K.N. Yung, I. Turlik · IEEE Transactions on Components Hybrids and Manufacturing Technology · 1991 · 50 citations

Engineering, Mechanical Engineering, Advanced Packaging (Semiconductors) +16

Thermal stress analysis of a multichip package design

Robert Darveaux, I. Turlik, Lih‐Tyng Hwang et al. · IEEE Transactions on Components Hybrids and Manufacturing Technology · 1989 · 46 citations

Engineering, Mechanical Engineering, Thermal Stress Analysis +18

Introducing the through-line deembedding procedure

M.B. Steer, S. Goldberg, G.A. Rinne et al. · 2003 · 42 citations

Engineering, Measurement, Approximate Open-short-line Calibration +18

A thermal module design for advanced packaging

Lih‐Tyng Hwang, I. Turlik, Arnold Reisman · Journal of Electronic Materials · 1987 · 42 citations

Advanced Packaging, Chip-scale Package, Package Design +8

Rows per page

1–5 of 25