I. Turlik

Rapid thermal curing of BCB dielectric

P Garrou, R.H. Heistand, Mitchell G. Dibbs et al. · IEEE Transactions on Components Hybrids and Manufacturing Technology · 1993 · 66 citations

Natural Sciences, Materials Engineering, Materials Science +17

Electroplated solder joints for flip-chip applications

E.K.N. Yung, I. Turlik · IEEE Transactions on Components Hybrids and Manufacturing Technology · 1991 · 50 citations

Engineering, Electrical Engineering, Materials Engineering +13

Thermal stress analysis of a multichip package design

Robert Darveaux, I. Turlik, Lih‐Tyng Hwang et al. · IEEE Transactions on Components Hybrids and Manufacturing Technology · 1989 · 46 citations

Engineering, Materials Engineering, Materials Science +17

Introducing the through-line deembedding procedure

M.B. Steer, S. Goldberg, G.A. Rinne et al. · 2003 · 42 citations

Engineering, Electrical Engineering, Metrology +12

A thermal module design for advanced packaging

Lih‐Tyng Hwang, I. Turlik, Arnold Reisman · Journal of Electronic Materials · 1987 · 42 citations

Engineering, Materials Engineering, Mechanical Engineering +14