9
Publications
171
Citations
9
H-Index
1986
Active since
R.H. Heistand is an author at Dow Chemical (United States) specializing in materials science, engineering, and microfabrication.
Top concepts
EngineeringMaterial ScienceMicrofabrication3D PrintingApplied PhysicsMicroelectronicsElectronic PackagingElectrical InsulationMaterials EngineeringElectrical Engineering
Publications per year
1986–2005
9
9
A photosensitive-BCB on laminate technology (MCM-LD)
Andrew Strandjord, R.H. Heistand, J. N. Bremmer et al. · 2002 · 17 citations
Planarization with Cyclotene™ 3022 (BCB) Polymer Coatings
T. M. Stokich, C. C. Fulks, Mark T. Bernius et al. · MRS Proceedings · 1993 · 16 citations
Cost Implications of Large Area MCM Processing
D. Frye, Mike Skinner, R.H. Heistand et al. · 2005 · 15 citations
Engineering, Mechanical Engineering, Production Management +21
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