D. Frye is an author at Dow Chemical (United States) specializing in materials science, electronic packaging, and engineering.
Top concepts
EngineeringMaterial ScienceElectronic PackagingApplied PhysicsSurface ScienceMicroelectronicsMicrofabricationMaterials EngineeringMechanical Engineering3D Printing
Publications per year
2005–2010
3
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Cost Implications of Large Area MCM Processing
D. Frye, Mike Skinner, R.H. Heistand et al. · 2005 · 15 citations
Engineering, Mechanical Engineering, Production Management +21
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