G.A. Rinne

Issues in accelerated electromigration of solder bumps

G.A. Rinne · Microelectronics Reliability · 2003 · 66 citations

Electrical Engineering, Electromigration Technique, Engineering +7

Introducing the through-line deembedding procedure

M.B. Steer, S. Goldberg, G.A. Rinne et al. · 2003 · 42 citations

Engineering, Measurement, Approximate Open-short-line Calibration +18

Solder bumping methods for flip chip packaging

G.A. Rinne · 2002 · 40 citations

Materials Science, Electrical Engineering, Solid Phase +11

Passivation schemes for copper/polymer thin-film interconnections used in multichip modules

G.M. Adema, Lih‐Tyng Hwang, G.A. Rinne et al. · IEEE Transactions on Components Hybrids and Manufacturing Technology · 1993 · 22 citations

Engineering, Thin Film Process Technology, Passivation Schemes +21

Passivation schemes for copper/polymer thin film interconnections used in multichip modules

G.M. Adema, Lih‐Tyng Hwang, G.A. Rinne et al. · 2003 · 19 citations

Engineering, Thin Film Process Technology, Passivation Schemes +20