Issues in accelerated electromigration of solder bumps

Grain size dependence of electromigration-induced failures in narrow interconnects

J. Cho, Carl V. Thompson · Applied Physics Letters · 1989 · 206 citations

Engineering, Electrical Engineering, Materials Science +17

Current Limitations of thin Film Conductors

James R. Black · 1982 · 33 citations

Engineering, Electrical Engineering, Materials Science +17

Reliability phenomena under AC stress

Chenming Hu · Microelectronics Reliability · 1998 · 19 citations

Engineering, Electrical Engineering, Fault-tolerant Systems +12

An empirical model for early resistance changes due to electromigration

J. Niehof, H.C. de Graaff, A.J. Mouthaan et al. · Solid-State Electronics · 1995 · 14 citations · Full text

Natural Sciences, Electrical Engineering, Physics +12

Investigation of the temperature dependence in Black’s equation using microscopic electromigration modeling

M. Tammaro · Journal of Applied Physics · 1999 · 10 citations

Natural Sciences, Materials Science, Physics +14