Reliability phenomena under AC stress

Berkeley reliability tools-BERT

R. Tu, Elyse Rosenbaum, Wayne Chan et al. · IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems · 1993 · 197 citations

Engineering, Computer Engineering, Electrical Engineering +17

Projecting interconnect electromigration lifetime for arbitrary current waveforms

B.K. Liew, N.W. Cheung, Chenming Hu · IEEE Transactions on Electron Devices · 1990 · 108 citations

Engineering, Electrical Engineering, Materials Science +16

Silicon dioxide breakdown lifetime enhancement under bipolar bias conditions

Elyse Rosenbaum, Zhaowei Liu, Chenming Hu · IEEE Transactions on Electron Devices · 1993 · 101 citations

Engineering, Electrical Engineering, Materials Science +13

AC electromigration characterization and modeling of multilayered interconnects

Larry Ting, Jeff S. May, W. R. Hunter et al. · 1993 · 87 citations

Engineering, Electrical Engineering, Materials Science +17

Hot-carrier-induced MOSFET degradation under AC stress

Jeong Y. Choi, P.K. Ko, Chenming Hu · IEEE Electron Device Letters · 1987 · 67 citations

Engineering, Electrical Engineering, Microelectronics +16