Journal of Applied Physics · 2001 · 96 citations · 18 references
EngineeringMaterials EngineeringMaterials ScienceCondensed Matter PhysicsElectronic MaterialsSemiconductor MaterialsEpitaxial GrowthSemiconductor Crystal GrowthSemiconductor InterfacesSemiconductor PhysicsSemiconductor SurfacesSilicon MaterialsEpitaxial MaterialsEpitaxial NucleationIn Situ HeatingPatterned SurfacesSiliconSilicon NanostructuresThin Oxide FilmsThin Oxide Layers
The formation of Ni silicides is studied by transmission electron microscopy during in situ heating experiments of 12 nm Ni layers on blanket silicon, or in patterned structures covered with a thin chemical oxide. It is shown that the first phase formed is the NiSi2 which grows epitaxially in pyramidal crystals. The formation of NiSi occurs quite abruptly around 400 °C when a monosilicide layer covers the disilicide grains and the silicon in between. The NiSi phase remains stable up to 800 °C, at which temperature the layer finally fully transforms to NiSi2. The monosilicide grains show different epitaxial relationships with the Si substrate. Ni2Si is never observed.
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Oxide mediated epitaxy of CoSi2 on silicon
R. T. Tung · Applied Physics Letters · 1996 · 181 citations
Salicidation process using NiSi and its device application
F. Deng, Rob Johnson, P.M. Asbeck et al. · Journal of Applied Physics · 1997 · 154 citations
Transmission electron microscopy of the formation of nickel silicides
H. Föll, P Shing Ho, K. N. Tu · Philosophical magazine. A/Philosophical magazine. A. Physics of condensed matter. Structure, defects and mechanical properties · 1982 · 136 citations
Natural Sciences, Materials Engineering, Materials Science +17