Formation of thin films of NiSi: Metastable structure, diffusion mechanisms in intermetallic compounds

Abstract

The formation of NiSi films from the reaction of Ni2Si with (100) and (111) silicon substrates was found to be controlled by a lattice diffusion process with an activation energy of 1.70 eV. In order to correlate kinetic information obtained by Rutherford backscattering with x-ray diffraction data, ‘‘standard’’ diffraction powder patterns for both Ni2Si and NiSi have been established. The existence of a metastable hexagonal form of NiSi has been confirmed. Observations on the formation of Ni2Si confirm previous investigations. The diffusion process at work during the formation of NiSi is discussed in terms of the crystalline anisotropy of this compound and compared to what is known about diffusion in other silicides.