Resin flow characteristics of underfill process on flip chip encapsulation

Analysis of the flow of encapsulant during underfill encapsulation of flip-chips

Sejin Han, K.K. Wang · IEEE Transactions on Components Packaging and Manufacturing Technology Part B · 1997 · 158 citations

Engineering, Materials Engineering, Materials Science +13

Underfill of flip chip on laminates: simulation and validation

Luu Nguyen, C. Quentin, P. Fine et al. · IEEE Transactions on Components and Packaging Technologies · 1999 · 78 citations

Engineering, Computational Engineering, Materials Engineering +15

Finite Element Analysis of Stress Singularities in Attached Flip Chip Packages

Aoyang Xu, H. F. Nied · Journal of Electronic Packaging · 2000 · 27 citations

Engineering, Materials Engineering, Materials Science +16

Influence of well profile and gate length on the ESD performance of a fully silicided 0.25 μm CMOS technology

Karlheinz Bock, Christian Russ, G. Badenes et al. · IEEE Transactions on Components Packaging and Manufacturing Technology Part C · 1998 · 23 citations

Engineering, Electrical Engineering, Electronic Materials +14