Concepedia

P. Fine

PF

Statistics

Publications

6

Citations

208

H-Index

6

Active since

1998

Affiliations

Texas Instruments (United States)(Current)

Georgia Institute of Technology

P. Fine is an author at Texas Instruments (United States) specializing in materials engineering, engineering, and underfill materials.

Publications per year

1998–2003

6

Publications

6

Underfill of flip chip on laminates: simulation and validation

Luu Nguyen, C. Quentin, P. Fine et al. · IEEE Transactions on Components and Packaging Technologies · 1999 · 78 citations

Engineering, Computational Engineering, Materials Engineering +15

Flip chip underfill flow characteristics and prediction

P. Fine, B. Cobb, Luu Nguyen · IEEE Transactions on Components and Packaging Technologies · 2000 · 48 citations

Engineering, Materials Engineering, Materials Science +14

High performance underfills development - materials, processes, and reliability

Luu Nguyen, Long Hoang, P. Fine et al. · 2002 · 47 citations

Engineering, Materials Engineering, Materials Science +16

Novel fast cure and reworkable underfill materials

Q.K. Tong, Biao Ma, A. Savoca et al. · 2003 · 13 citations

Natural Sciences, Materials Engineering, Materials Science +14

Reworkable Flip Chip underfill : Materials and processes

Luu Nguyen, P. Fine, B. Cobb et al. · 1998 · 12 citations

Engineering, Materials Engineering, Materials Science +10

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