High performance underfills development - materials, processes, and reliability

Abstract

The typical underfill enhances the solder life of flip chip structures by up to an order of magnitude. With increasing packaging applications requiring flip chip interconnection, much industry interest has been devoted to the development of better underfill materials, which are more cost-effective and provide better performance than current commercial materials. This paper presents the highlights of a recent DARPA-funded program to develop new underfill materials for low-cost flip chip applications.