Concepedia

B. Cobb

BC

Statistics

Publications

5

Citations

161

H-Index

5

Active since

1998

Affiliations

Texas Instruments (United States)(Current)

B. Cobb is an author at Texas Instruments (United States) specializing in materials engineering, engineering, and materials science.

Publications per year

1998–2003

5

Publications

5

Underfill of flip chip on laminates: simulation and validation

Luu Nguyen, C. Quentin, P. Fine et al. · IEEE Transactions on Components and Packaging Technologies · 1999 · 78 citations

, , +15

Flip chip underfill flow characteristics and prediction

P. Fine, B. Cobb, Luu Nguyen · IEEE Transactions on Components and Packaging Technologies · 2000 · 48 citations

, , +14

Novel fast cure and reworkable underfill materials

Q.K. Tong, Biao Ma, A. Savoca et al. · 2003 · 13 citations

, , +14

Reworkable Flip Chip underfill : Materials and processes

Luu Nguyen, P. Fine, B. Cobb et al. · 1998 · 12 citations

, , +10

Flip chip underfill flow characteristics and prediction

P. Fine, B. Cobb, Luu Nguyen · 2003 · 10 citations

, , +14

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