Underfill Encapsulation is a microelectronic packaging technique in which a polymeric adhesive material is selectively dispensed and cured at the interface between a MEMS device and its substrate to enhance mechanical reliability and mitigate thermal stress by filling the narrow gap beneath the device.
77
Publications
2.6K
Citations
241
Authors
60
Institutions
Publications per year
2017–2026
8
Parents
Publications
77
1–5 of 77
Authors
241
- CW
8
h-index
- MA
7
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- AA
7
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- FC
6
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- JP
4
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1–5 of 241
Institutions
60
Universiti Sains Malaysia
George Town, Malaysia
10 h-index
36 publications
961 citations
Georgia Institute of Technology
Atlanta, United States
10 h-index
24 publications
1.2K citations
Nanyang Technological University
Singapore, Singapore
6 h-index
14 publications
420 citations
Motorola (United States)
Schaumburg, United States
6 h-index
30 publications
1.1K citations
University of Hong Kong
Pok Fu Lam, Hong Kong
3 h-index
8 publications
200 citations
Auburn University
Auburn, United States
3 h-index
9 publications
138 citations
Hong Kong University of Science and Technology
Hong Kong, Hong Kong
3 h-index
8 publications
200 citations
Hewlett-Packard (United States)
Palo Alto, United States
3 h-index
6 publications
172 citations
1–8 of 60
Venues
- Microelectronics Reliability
6 publications · 200 citations
6
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- IEEE Transactions on Components and Packaging Technologies
5 publications · 181 citations
5
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- Soldering and Surface Mount Technology
5 publications · 89 citations
5
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- Journal of Electronic Packaging
4 publications · 201 citations
4
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- IEEE Transactions on Electronics Packaging Manufacturing
3 publications · 76 citations
3
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1–5