Aizat Abas

Effects of the preheat layer thickness on surface/submerged flame during porous media combustion of micro burner

Ayub Ahmed Janvekar, Muhamad Azman Miskam, Aizat Abas et al. · Energy · 2017 · 69 citations

Micro Burner, Preheat Layer Thickness, Engineering +7

Effect of ILU dispensing types for different solder bump arrangements on CUF encapsulation process

Aizat Abas, Haslinda M.S., M. H. H. Ishak et al. · Microelectronic Engineering · 2016 · 38 citations

Materials Science, Engineering, Mechanical Engineering +2

Effect of solder bump shapes on underfill flow in flip-chip encapsulation using analytical, numerical and PIV experimental approaches

Fei Chong Ng, Aizat Abas, M.Z. Abdullah · Microelectronics Reliability · 2018 · 37 citations

Materials Science, Chip-scale Package, Engineering +12

Discrete phase method study of ball grid array underfill process using nano-silica filler-reinforced composite-encapsulant with varying filler loadings

Fei Chong Ng, Aizat Abas, Z L Gan et al. · Microelectronics Reliability · 2017 · 36 citations

Materials Science, Engineering, Nano-silica Filler-reinforced Composite-encapsulant +2

SAC–xTiO₂ nano-reinforced lead-free solder joint characterizations in ultra-fine package assembly

Fakhrozi Che Ani, Azman Jalar, Abdullah Aziz Saad et al. · Soldering and Surface Mount Technology · 2018 · 36 citations

Materials Science, Materials Engineering, Chemical Engineering +14