Concepedia
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Publications
1
Citations
124
H-Index
Active since
1995
Richard J. Prosman is an author specializing in multichip modules, flip-chip bonding, and wafer-to-wafer bonding.
Publications per year
1995–1995
Chip on Board: Technologies for Multichip Modules
John H. Lau, Richard J. Prosman · Journal of Electronic Packaging · 1995 · 124 citations · Full text
Engineering, Electrical Engineering, Materials Science +17
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