Concepedia

Publication | Closed Access

High-performance epoxy/binary spherical alumina composite as underfill material for electronic packaging

DOI

150

Citations

45

References

2018

Year

Chao Chen, Xue Yang, Xiongwei Li, Yingfeng Wen, Jinwei Liu, Zhigang Xue, Dean Shi, Xingping Zhou, Xiaolin Xie, Yiu‐Wing Mai
Composites Part A Applied Science and Manufacturing

References

YearCitations

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