IEEE Transactions on Electron Devices · 2014 · 27 citations · 13 references
EngineeringElectrical EngineeringMicroelectronicsSemiconductor DevicesThin FilmsDevice CharacterizationDevice ModelingDevice ScalingIntegrated Circuit DesignMetal-oxide-semiconductor Field-effect TransistorsThin-film TransistorsFin Field-effect TransistorsGate Oxide InterfacesGate Oxide ScalingGate Oxide Thickness EffectsLine RoughnessLine-edge RoughnessMismatchThreshold Voltage
In this brief, threshold voltage mismatch of fully integrated n-type FinFETs based on a gate-first process was studied experimentally. Significantly improved threshold voltage mismatch due to undoped FIN body was confirmed with the experimental data. By comparing mismatch values of thin- and thick-oxide nMOS, we found that factors, which do not scale with gate oxide thickness, including line edge roughness and metal-gate granularity (MGG), can explain ~ 60% of total mismatch of thin-oxide devices. Moreover, we report a convex shape of threshold voltage mismatch following the increase of the number of FINs and propose a possible explanation of the abnormal behavior. Due to channel width quantization, two competing contributors impact mismatch: as FIN number becomes smaller mismatch due to MGG likely play an important role which increases threshold voltage mismatch, whereas FIN number becomes larger, systematic variation becomes the main factor, which also increases threshold voltage mismatch.
13
Silicon CMOS devices beyond scaling
Wilfried Haensch, E. Nowak, R.H. Dennard et al. · IBM Journal of Research and Development · 2006 · 455 citations
Engineering, Computer Engineering, Electrical Engineering +17
Statistical variability and reliability in nanoscale FinFETs
Xingsheng Wang, A. R. Brown, B. Cheng et al. · 2011 · 274 citations