Concepedia

Effect of reflow numbers on the interfacial reaction and shear strength of flip chip solder joints

Dae‐Gon Kim, Jong‐Woong Kim, Sang-Su Ha, Bo‐In Noh, Ja‐Myeong Koo, Dong-Woon Park, Myung-Wan Ko, Seung‐Boo Jung

Journal of Alloys and Compounds · 2007 · 32 citations · 12 references

DOI

Concepts

References

12

Solder reaction-assisted crystallization of electroless Ni–P under bump metallization in low cost flip chip technology

Jihun Jang, P. G. Kim, K. N. Tu et al. · Journal of Applied Physics · 1999 · 283 citations

, , +17

Electromigration of eutectic SnPb and SnAg3.8Cu0.7 flip chip solder bumps and under-bump metallization

T. Y. Lee, K. N. Tu, D. R. Frear · Journal of Applied Physics · 2001 · 226 citations

, , +12

Solid state interfacial reaction of Sn–37Pb and Sn–3.5Ag solders with Ni–P under bump metallization

Min He, Zhong Chen, Guo-Jun Qi · Acta Materialia · 2004 · 205 citations

, , +17

Interfacial reactions between lead-free SnAgCu solder and Ni(P) surface finish on printed circuit boards

Kejun Zeng, Vesa Vuorinen, J.K. Kivilahti · IEEE Transactions on Electronics Packaging Manufacturing · 2002 · 121 citations

, , +17

Interface microstructures between Ni-P alloy plating and Sn–Ag–(Cu) lead-free solders

Chi-Won Hwang, Katsuaki Suganuma, Masayuki Kiso et al. · Journal of materials research/Pratt's guide to venture capital sources · 2003 · 87 citations

, , +11