Concepedia

Myung-Wan Ko

MK

Statistics

Publications

2

Citations

47

H-Index

2

Active since

2002

Affiliations

Sejong University(Current)

Myung-Wan Ko is an author at Sejong University specializing in materials engineering, materials science, and flip-chip bonding.

Publications per year

2002–2007

2

Publications

2

Effect of reflow numbers on the interfacial reaction and shear strength of flip chip solder joints

Dae‐Gon Kim, Jong‐Woong Kim, Sang-Su Ha et al. · Journal of Alloys and Compounds · 2007 · 32 citations

, , +12

Microstructure and mechanical properties of Al 6061 joints diffusion brazed using Cu interlayer

Seung Yong Shin, Myung-Wan Ko, D. C. Cho et al. · Journal of Materials Science Letters · 2002 · 15 citations

, , +8

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