Concepedia

Sang-Su Ha

SH

Statistics

Publications

12

Citations

307

H-Index

11

Active since

2007

Affiliations

Sungkyunkwan University(Current)

Hanwha Techwin (South Korea)

Samsung (South Korea)

Sang-Su Ha is an author at Sungkyunkwan University specializing in materials science, materials engineering, and soldering joints.

Publications per year

2007–2015

12

Publications

12

Systematical study of 14nm FinFET reliability: From device level stress to product HTOL

Changze Liu, Hyun Chul Sagong, Hyejin Kim et al. · 2015 · 45 citations

Engineering, Computer Engineering, Electrical Engineering +17

Effect of multiple reflows on interfacial reaction and shear strength of Sn–Ag electroplated solder bumps for flip chip package

Sang-Su Ha, Jin‐Kyu Jang, Sang-Ok Ha et al. · Microelectronic Engineering · 2009 · 36 citations

Engineering, Materials Engineering, Materials Science +15

Effect of reflow numbers on the interfacial reaction and shear strength of flip chip solder joints

Dae‐Gon Kim, Jong‐Woong Kim, Sang-Su Ha et al. · Journal of Alloys and Compounds · 2007 · 32 citations

Engineering, Materials Engineering, Materials Science +12

Effect of high-speed loading conditions on the fracture mode of the BGA solder joint

Jong-Woong Kim, Jin‐Kyu Jang, Sang-Ok Ha et al. · Microelectronics Reliability · 2008 · 29 citations

Engineering, Materials Engineering, Materials Science +12

Effect of Pd Addition in ENIG Surface Finish on Drop Reliability of Sn-Ag-Cu Solder Joint

Sang-Su Ha, Jongwoo Park, Seung‐Boo Jung · MATERIALS TRANSACTIONS · 2011 · 27 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +15

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