Jong-Woong Kim

Effect of aging conditions on interfacial reaction and mechanical joint strength between Sn–3.0Ag–0.5Cu solder and Ni–P UBM

Dae‐Gon Kim, Jong-Woong Kim, Seung‐Boo Jung · Materials Science and Engineering B · 2005 · 48 citations

Natural Sciences, Materials Engineering, Materials Science +14

Reexamination of the solder ball shear test for evaluation of the mechanical joint strength

Jong-Woong Kim, Seung‐Boo Jung · International Journal of Solids and Structures · 2005 · 38 citations

Natural Sciences, Materials Engineering, Materials Science +12

Characterization of the shear test method with low melting point In–48Sn solder joints

Jong-Woong Kim, Seung‐Boo Jung · Materials Science and Engineering A · 2005 · 33 citations

Natural Sciences, Materials Engineering, Materials Science +12

Effect of high-speed loading conditions on the fracture mode of the BGA solder joint

Jong-Woong Kim, Jin‐Kyu Jang, Sang-Ok Ha et al. · Microelectronics Reliability · 2008 · 29 citations

Engineering, Materials Engineering, Materials Science +12

Failure behaviors of BGA solder joints under various loading conditions of high-speed shear test

Jong-Woong Kim, Young‐Chul Lee, Sang-Su Ha et al. · Journal of Materials Science Materials in Electronics · 2008 · 25 citations

Engineering, Materials Engineering, Materials Science +12