Concepedia

Sang-Ok Ha

SH

Statistics

Publications

6

Citations

129

H-Index

6

Active since

2008

Affiliations

Sungkyunkwan University(Current)

Hanwha Techwin (South Korea)

Sang-Ok Ha is an author at Sungkyunkwan University specializing in soldering joints, soldered joints, and materials engineering.

Publications per year

2008–2010

6

Publications

6

Effect of multiple reflows on interfacial reaction and shear strength of Sn–Ag electroplated solder bumps for flip chip package

Sang-Su Ha, Jin‐Kyu Jang, Sang-Ok Ha et al. · Microelectronic Engineering · 2009 · 36 citations

Engineering, Materials Engineering, Materials Science +15

Effect of high-speed loading conditions on the fracture mode of the BGA solder joint

Jong-Woong Kim, Jin‐Kyu Jang, Sang-Ok Ha et al. · Microelectronics Reliability · 2008 · 29 citations

Engineering, Materials Engineering, Materials Science +12

Mechanical Property Evaluation of Sn-3.0A-0.5Cu BGA Solder Joints Using High-Speed Ball Shear Test

Sang-Su Ha, Jin‐Kyu Jang, Sang-Ok Ha et al. · Journal of Electronic Materials · 2009 · 21 citations

Natural Sciences, Materials Engineering, Materials Science +11

Electromigration Behavior in Sn-37Pb and Sn-3.0Ag-0.5Cu Flip-Chip Solder Joints under High Current Density

Sang-Su Ha, Jong‐Woong Kim, Jeong‐Won Yoon et al. · Journal of Electronic Materials · 2008 · 19 citations

Engineering, Electrical Engineering, Materials Science +16

Effects of Different Kinds of Underfills and Temperature–Humidity Treatments on Drop Reliability of Board-Level Packages

Bo‐In Noh, Jeong‐Won Yoon, Sang-Ok Ha et al. · Journal of Electronic Materials · 2010 · 13 citations

Pharmacy, Systems Engineering, Packaging Design +14

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