Advances in arrayed microcolumn lithography

L. P. Muray, J. P. Spallas, C. Stebler, K. Lee, Marián Maňkoš, Yautzong Hsu, Max Gmür, T. H. P. Chang

Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena · 2000 · 51 citations · 7 references

Concepts

Abstract

A microcolumn array has been designed, fabricated, and tested. The 2×2 array has a 2 cm pitch and operates at 1 keV. Key components include vertical interconnects, silicon low-distortion octupole deflectors, miniature long-range flexure-based tip positioners, and low-power thermal field emitters. Initial results show no observable crosstalk between columns during simultaneous operation at a 50 MHz beam blanking rate. Preliminary lithography results are presented.

References

7