Metal–oxide–semiconductor devices using Ga2O3 dielectrics on n-type GaN

Abstract

Using a photoelectrochemical method involving a He–Cd laser, Ga2O3 oxide layers were directly grown on n-type GaN. We demonstrated the performance of the resultant metal–oxide–semiconductor devices based on the grown Ga2O3 layer. An extremely low reverse leakage current of 200 pA was achieved when devices operated at −20 V. Furthermore, high forward and reverse breakdown electric fields of 2.80 MV/cm and 5.70 MV/cm, respectively, were obtained. Using a photoassisted current–voltage method, a low interface state density of 2.53×1011 cm−2 eV−1 was estimated. The varactor devices permit formation of inversion layers, so that they may be applied for the fabrication of metal–oxide–semiconductor field-effect transistors.