Concepedia

Tungsten Interconnects

Tungsten Interconnects is a type of integrated circuit interconnect technology in which tungsten is used as the primary conductive material to form vertical vias and plugs that enable electrical connections between different metal layers in multilevel interconnect structures, distinguished by its high thermal stability, low resistivity, and compatibility with chemical vapor deposition processes.

53

Publications

1.8K

Citations

240

Authors

61

Institutions

Publications per year

2017–2026

3

Parents

Publications

53

Phase transformation of thin sputter-deposited tungsten films at room temperature

S. M. Rossnagel, I. C. Noyan, C. Cabral · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena · 2002 · 172 citations

, , +17

Tungsten-Based SOI Microhotplates for Smart Gas Sensors

S. Z. Ali, Florin Udrea, W. I. Milne et al. · Journal of Microelectromechanical Systems · 2008 · 140 citations

, , +17

Silicides and local interconnections for high-performance VLSI applications

R. Mann, L. A. Clevenger, P. Agnello et al. · IBM Journal of Research and Development · 1995 · 102 citations

, , +17

On-Chip Interconnect Conductor Materials for End-of-Roadmap Technology Nodes

Anshul A. Vyas, Changjian Zhou, Cary Y. Yang · IEEE Transactions on Nanotechnology · 2016 · 84 citations

, , +17

Progress in second-generation HTS wire development and manufacturing

V. Selvamanickam, Y. Chen, X. Xiong et al. · Physica C Superconductivity · 2008 · 79 citations

, , +10

1–5 of 53

Authors

240

  1. BG
    B. Gorowitz

    General Electric (United States), United States

    4 publications · 50 citations

    4

    h-index

  2. RS
    R. Saia

    General Electric (United States), United States

    3 publications · 40 citations

    3

    h-index

  3. DW
    David W. Woodruff

    General Electric (United States), United States

    3 publications · 40 citations

    3

    h-index

  4. DB
    D.M. Brown

    General Electric (United States), United States

    3 publications · 40 citations

    3

    h-index

  5. CK
    Carter Kaanta

    IBM (United States), United States

    3 publications · 78 citations

    3

    h-index

1–5 of 240

Institutions

61

  1. IBM (United States)

    Armonk, United States

    9 h-index

    29 publications

    1.4K citations

  2. Massachusetts Institute of Technology

    Cambridge, United States

    5 h-index

    21 publications

    522 citations

  3. General Electric (United States)

    Boston, United States

    5 h-index

    17 publications

    225 citations

  4. MIT Lincoln Laboratory

    Lexington, United States

    4 h-index

    20 publications

    502 citations

  5. Georgia Institute of Technology

    Atlanta, United States

    2 h-index

    3 publications

    104 citations

  6. National University of Singapore

    Singapore, Singapore

    2 h-index

    5 publications

    97 citations

  7. IBM Research - Thomas J. Watson Research Center

    Yorktown Heights, United States

    2 h-index

    2 publications

    48 citations

  8. Qualcomm (United States)

    San Diego, United States

    2 h-index

    4 publications

    257 citations

1–8 of 61

Venues

  1. IEEE Electron Device Letters

    4 publications · 86 citations

    4

    h-index

  2. Journal of The Electrochemical Society

    JES · 3 publications · 109 citations

    3

    h-index

  3. Thin Solid Films

    3 publications · 66 citations

    3

    h-index

  4. Microelectronic Engineering

    3 publications · 97 citations

    3

    h-index

  5. Journal of Applied Physics

    2 publications · 62 citations

    2

    h-index

1–5