B. Gorowitz - Concepedia

Author

B. Gorowitz

General Electric (United States)

Also Known As

B Gorowitz, B. GOROWITZ, B. Gorowitz, BERNARD GOROWITZ, Bernard Gorowitz

Publications

292

Citations

H-Index

Concepts

All Affiliations

General Electric (United States)General Electric (Netherlands)

About

B. Gorowitz is an author at General Electric (United States) specializing in engineering, electrical engineering, and applied physics.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	10	11	183
2	Electrical Engineering	9	9	150
3	Applied Physics	8	8	117
4	Computer Engineering	2	2	33
5	Chemical Engineering	1	1	16

B. Gorowitz

Publications

183

Citations

H-Index

Page 1

	Year	Citations
Magnetically Driven Fast-Acting Valve for Gas Injection into High Vacua B. Gorowitz, K. G. Moses, P. Gloersen Review of Scientific Instruments Electrical EngineeringGas InjectionEngineeringPlasma ApplicationPlasma Computation	1960	37
Direct W–Ti contacts to silicon Shimon Cohen, M. J. Kim, B. Gorowitz, Applied Physics Letters Materials EngineeringMaterials ScienceElectrical EngineeringShallow JunctionsEngineering	1984	18
Mo/TiW contact for VLSI applications M.J. Kim, D.M. Brown, Shimon Cohen, IEEE Transactions on Electron Devices High ConductivityVlsi DesignEngineeringElectronic Design AutomationComputer Architecture	1985	18
Performance of an electrically triggered repetitively pulsed coaxialplasma engine. B. Gorowitz, T. W. Karras, P. Gloersen AIAA Journal EngineeringAerospace EngineeringCoaxial Plasma EngineTotal Mass FlowEngine Thrust	1966	17
Plasma Etching Methods for the Formation of Planarized Tungsten Plugs Used in Multilevel VLSI Metallizations R. Saia, B. Gorowitz, David W. Woodruff, Journal of The Electrochemical Society EngineeringTungsten PlugsVacuum DeviceChemical DepositionPlasma Processing	1988	17
The Reactive Ion Etching of Molybdenum and Bilayer Metallization Systems Containing Molybdenum R. Saia, B. Gorowitz Journal of The Electrochemical Society EngineeringVacuum DeviceReactive Ion EtchingPlasma ProcessingChemical Engineering	1988	16
Three dimensional hybrid wafer scale integration using the GE high density interconnect technology R.J. Wojnarowski, R.A. Fillion, B. Gorowitz, EngineeringDevice IntegrationMultichip ModuleIntegrated CircuitsInterconnect (Integrated Circuits)	2002	15
Selective CVD tungsten via plugs for multilevel metallization D.M. Brown, B. Gorowitz, P. A. Piacente, EngineeringMetal Interconnection PitchIntegrated CircuitsInterconnect (Integrated Circuits)Physical Design (Electronics)	1986	13
Energy efficiency trends in a coaxial gun plasma engine system. P. Gloersen, B. Gorowitz, James T. Kenney AIAA Journal Energy EfficienciesElectrical EngineeringEngineeringEnergy EfficiencyEnergy Storage Voltages	1966	12
Application of selective CVD tungsten for low contact resistance via filling to aluminum multilayer interconnection Sung Min Rang, Robert H. Chow, R. H. Wilson, Journal of Electronic Materials Materials ScienceMaterials EngineeringElectrical EngineeringLow Contact ResistanceEngineering	1988	10

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