Concepedia

Temporary Bonding Layers

Temporary Bonding Layers is a sacrificial material system used in microfabrication that temporarily adheres a device wafer to a carrier substrate during processing and is subsequently removed to release the device layer, distinguishing itself by enabling mechanical support and thermal stability while allowing non-destructive delamination after fabrication.

37

Publications

1K

Citations

221

Authors

52

Institutions

Publications per year

2017–2026

14

Parents

Publications

37

Fabrication of SU-8 multilayer microstructures based on successive CMOS compatible adhesive bonding and releasing steps

María Agirregabiria, F.J. Blanco, J. Berganzo et al. · Lab on a Chip · 2005 · 138 citations

, , +17

How to select adhesive materials for temporary bonding and de-bonding of 200mm and 300mm thin-wafer handling for 3D IC integration?

Wei‐Chi Tsai, Hwan‐You Chang, Chi‐Hsien Chien et al. · 2011 · 58 citations

, , +17

UV-curing and thermal stability of dual curable urethane epoxy adhesives for temporary bonding in 3D multi-chip package process

Seung‐Woo Lee, Ji‐Won Park, Cho-Hee Park et al. · International Journal of Adhesion and Adhesives · 2013 · 53 citations

, , +17

High-Performance Temporary Adhesives for Wafer Bonding Applications

Rama Puligadda, Sunil K. Pillalamarri, Chad Brubaker et al. · MRS Proceedings · 2006 · 51 citations

, , +9

Temporary Bonding and DeBonding Enabling TSV Formation and 3D Integration for Ultra-thin Wafers

Stefan Pargfrieder, Paul Kettner, Mark Privett et al. · 2008 · 45 citations

, , +17

1–5 of 37

Authors

221

  1. AP
    Alain Phommahaxay

    IMEC, Belgium

    7 publications · 153 citations

    7

    h-index

  2. EB
    Eric Beyne

    IMEC, Belgium

    6 publications · 136 citations

    6

    h-index

  3. AG
    Alice Guerrero

    Brewer Science (United States), United States

    4 publications · 87 citations

    4

    h-index

  4. GB
    Gerald Beyer

    IMEC, Belgium

    4 publications · 87 citations

    4

    h-index

  5. KY
    Kim Yess

    Brewer Science (United States), United States

    3 publications · 53 citations

    3

    h-index

1–5 of 221

Institutions

52

  1. Brewer Science (United States)

    Rolla, United States

    8 h-index

    27 publications

    682 citations

  2. IMEC

    Leuven, Belgium

    7 h-index

    59 publications

    1.3K citations

  3. Laboratoire d'Électronique des Technologies de l'Information

    Grenoble, France

    5 h-index

    42 publications

    684 citations

  4. Commissariat à l'Énergie Atomique et aux Énergies Alternatives

    Paris, France

    5 h-index

    42 publications

    684 citations

  5. CEA Grenoble

    Grenoble, France

    4 h-index

    37 publications

    579 citations

  6. Chinese Academy of Sciences

    Beijing, China

    4 h-index

    26 publications

    1.1K citations

  7. Institut polytechnique de Grenoble

    Grenoble, France

    4 h-index

    32 publications

    494 citations

  8. EV Group (Austria)

    Sankt Florian am Inn, Austria

    4 h-index

    12 publications

    279 citations

1–8 of 52

Venues

  1. 2

    h-index

  2. Sensors

    1 publications · 44 citations

    1

    h-index

  3. Lab on a Chip

    1 publications · 138 citations

    1

    h-index

  4. 1

    h-index

  5. Microsystem Technologies

    1 publications · 10 citations

    1

    h-index

1–5