Sunil K. Pillalamarri

Author

Missouri University of Science and Technology

Also Known As

S PILLALAMARRI, S. Pillalamarri, Sunil K Pillalamarri, Sunil K. Pillalamarri, Sunil Pillalamarri

Publications

652

Citations

H-Index

Concepts

All Affiliations

Missouri University of Science and Technology Brewer Science (United States)

About

Sunil K. Pillalamarri is an author at Missouri University of Science and Technology specializing in engineering, materials science, and polymer science.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	6	6	618
2	Chemistry	2	2	450
3	Applied Physics	1	1	15
4	Chemical Engineering	1	1	163
5	Macromolecular Science	1	1	163

Sunil K. Pillalamarri

Publications

647

Citations

H-Index

Page 1

	Year	Citations
One-Pot Synthesis of Polyaniline−Metal Nanocomposites Sunil K. Pillalamarri, Frank D. Blum, Akira Tokuhiro, Chemistry of Materials Materials ScienceNanofiberEngineeringNanomaterialsPolymer Science	2005	287
Radiolytic Synthesis of Polyaniline Nanofibers: A New Templateless Pathway Sunil K. Pillalamarri, Frank D. Blum, Akira Tokuhiro, Chemistry of Materials NanofiberOrganic Material ChemistryChemical EngineeringSynthetic MacromoleculeEngineering	2004	163
One-step fabrication of a polyaniline nanofiber vapor sensor Zhi Li, Frank D. Blum, Massimo F. Bertino, Sensors and Actuators B Chemical Materials ScienceEngineeringSensorsOne-step FabricationSensor Design	2008	70
High-Performance Temporary Adhesives for Wafer Bonding Applications Rama Puligadda, Sunil K. Pillalamarri, W. Hong, MRS Proceedings EngineeringMicrofabricationHigh-performance Temporary AdhesivesAdhesive MaterialMechanical Engineering	2006	48
Photolithographic synthesis of polyaniline nanofibres Lalani K. Werake, J. G. Story, Massimo F. Bertino, Nanotechnology Materials SciencePolyaniline NanofibresBulk PolyanilinePolymer MaterialEngineering	2005	35
Synthesis of polyaniline–gold nanocomposites using “grafting from” approach Sunil K. Pillalamarri, Frank D. Blum, Massimo F. Bertino Chemical Communications	2005	29
High-Temperature Spin-On Adhesives for Temporary Wafer Bonding Sunil K. Pillalamarri, Rama Puligadda, Chad Brubaker, Journal of Microelectronics and Electronic Packaging EngineeringMechanical EngineeringWafer Scale ProcessingAdvanced Packaging (Semiconductors)Temporary Wafer Bonding	2007	15

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