Concepedia

Rama Puligadda

RP

Statistics

Publications

8

Citations

251

H-Index

8

Active since

2006

Affiliations

Brewer Science (United States)(Current)

EV Group (Austria)

Commissariat à l'Énergie Atomique et aux Énergies Alternatives

Institut polytechnique de Grenoble

Rama Puligadda is an author at Brewer Science (United States) specializing in materials science, engineering, and wafer bonding.

Publications per year

2006–2013

8

Publications

8

Integration of a temporary carrier in a TSV process flow

Jean Charbonnier, S. Chéramy, David Henry et al. · 2009 · 61 citations

Engineering, Electrical Engineering, Materials Science +17

High-Performance Temporary Adhesives for Wafer Bonding Applications

Rama Puligadda, Sunil K. Pillalamarri, Chad Brubaker et al. · MRS Proceedings · 2006 · 51 citations

Engineering, Materials Engineering, Materials Science +9

Facilitating Ultrathin Wafer Handling for TSV Processing

A. Jouve, Shelly Fowler, Mark Privett et al. · 2008 · 42 citations

Engineering, Materials Engineering, Materials Science +17

Ultrathin wafer handling in 3D Stacked IC manufacturing combining a novel ZoneBOND&#x2122; temporary bonding process with room temperature peel debonding

Alain Phommahaxay, Anne Jourdain, Greet Verbinnen et al. · 2012 · 34 citations

Engineering, Manufacturing Engineering, Materials Science +15

Photoactive Polyesters Containing<i>o</i>-Nitro Benzyl Ester Functionality for Photodeactivatable Adhesion

Stephen M. June, Takeo Suga, William H. Heath et al. · The Journal of Adhesion · 2013 · 19 citations

Natural Sciences, Materials Engineering, Materials Science +17

1–5 of 8