Concepedia

Packaging Failure Modes

Packaging Failure Modes is a systematic classification of distinct mechanisms by which retort-packaged products fail to maintain integrity, safety, or functionality under prescribed conditions, distinguishing itself from general failure analyses by focusing specifically on the structural, material, and process-related weaknesses inherent in retort packaging systems.

45

Publications

1.3K

Citations

157

Authors

53

Institutions

Publications per year

2017–2026

6

Parents

Publications

45

Failure modes and FEM analysis of power electronic packaging

Hua Ye, Minghui Lin, Cemal Basaran · Finite Elements in Analysis and Design · 2002 · 162 citations

, , +16

Analysis of flip-chip packaging challenges on copper/low-k interconnects

L.L. Mercado, Cindy Goldberg, Shun-Meen Kuo et al. · IEEE Transactions on Device and Materials Reliability · 2003 · 82 citations

, , +17

Failure mechanisms of lead-free chip scale package interconnections under fast mechanical loading

Toni T. Mattila, J.K. Kivilahti · Journal of Electronic Materials · 2005 · 78 citations

, , +16

Failure-mechanism models for conductive-filament formation

B. Rudra, D. A. Jennings · IEEE Transactions on Reliability · 1994 · 51 citations

, , +17

Analysis on failure modes and mechanisms of LED

Guoguang Lu, Shaohua Yang, Yun Huang · 2009 · 46 citations

, , +16

1–5 of 45

Authors

157

  1. XF
    Xuejun Fan

    Lamar University, United States

    2 publications · 53 citations

    2

    h-index

  2. SK
    Sayoon Kang

    Samsung (South Korea), South Korea

    2 publications · 37 citations

    2

    h-index

  3. TL
    Tien-Yu Lee

    Motorola (United States), United States

    2 publications · 109 citations

    2

    h-index

  4. JL
    Jinhyuk Lee

    Massachusetts Institute of Technology, United States

    2 publications · 56 citations

    2

    h-index

  5. PT
    Panagiotis Tsarouhas

    University of Thessaly, Greece

    2 publications · 64 citations

    2

    h-index

1–5 of 157

Institutions

53

  1. Samsung (South Korea)

    Seoul, South Korea

    4 h-index

    14 publications

    271 citations

  2. Texas Instruments (United States)

    Dallas, United States

    3 h-index

    9 publications

    228 citations

  3. Intel (United States)

    Santa Clara, United States

    3 h-index

    4 publications

    151 citations

  4. Motorola (United States)

    Schaumburg, United States

    2 h-index

    5 publications

    300 citations

  5. Institute of Microelectronics

    Singapore, Singapore

    2 h-index

    7 publications

    132 citations

  6. Helsinki Institute for Information Technology

    Espoo, Finland

    1 h-index

    2 publications

    156 citations

  7. Victoria University of Wellington

    Wellington, New Zealand

    1 h-index

    2 publications

    32 citations

  8. Altera (United States)

    San Jose, United States

    1 h-index

    5 publications

    60 citations

1–8 of 53

Venues

  1. Microelectronics Reliability

    8 publications · 192 citations

    8

    h-index

  2. 4

    h-index

  3. Journal of Food Engineering

    2 publications · 48 citations

    2

    h-index

  4. IEEE Transactions on Advanced Packaging

    2 publications · 39 citations

    2

    h-index

  5. 1

    h-index

1–5