Concepedia

Tien-Yu Lee

TL

Statistics

Publications

6

Citations

234

H-Index

6

Active since

1988

Affiliations

Motorola (United States)(Current)

Tien-Yu Lee is an author at Motorola (United States) specializing in engineering, mechanical engineering, and electronic packaging.

Top concepts

EngineeringElectronic PackagingMechanical EngineeringMicroelectronicsElectrical EngineeringHeat TransferRefrigerationMaterial ScienceMicrofabricationThermal Engineering

Publications per year

1988–2005

6

Publications

6

Analysis of flip-chip packaging challenges on copper/low-k interconnects

L.L. Mercado, Cindy Goldberg, Shun-Meen Kuo et al. · IEEE Transactions on Device and Materials Reliability · 2003 · 82 citations

Materials Engineering, Materials Science, Electrical Engineering +14

Design optimization of an integrated liquid-cooled IGBT power module using CFD technique

Tien-Yu Lee · IEEE Transactions on Components and Packaging Technologies · 2000 · 56 citations

Engineering, Vlsi Design, Liquid Metal Cooling +16

Assessment of backside processes through die strength evaluation

Betty Yeung, V. Hause, Tien-Yu Lee · IEEE Transactions on Advanced Packaging · 2000 · 34 citations

Engineering, Mechanical Engineering, Damage Mechanism +17

Analysis of RF MEMS switch packaging Process for yield improvement

L.L. Mercado, S.-M. Kuo, Tien-Yu Lee et al. · IEEE Transactions on Advanced Packaging · 2005 · 27 citations

Engineering, Mechanical Engineering, Microelectromechanical Systems +18

Fluid Selection and Property Effects in Single-and Two-Phase Immersion Cooling

J. R. Saylor, Avram Bar‐Cohen, Tien-Yu Lee et al. · IEEE Transactions on Components Hybrids and Manufacturing Technology · 1988 · 25 citations

Engineering, Liquid Metal Cooling, Single-phase Flow +22

1–5 of 6