High-bandwidth Memory Integration

High-Bandwidth Memory Integration is a GPU architecture design principle that incorporates stacked, wide-interface memory subsystems directly adjacent to the processor die to enable significantly higher memory bandwidth and energy efficiency compared to traditional off-chip memory configurations.

Publications

158

Citations

Authors

Institutions

Publications per year

2017–2026

Parents

Graphics Processing Unit Architecture

Publications

Scalable Chiplet package using Fan-Out Embedded Bridge

Joe Lin, C. Key Chung, C. F. Lin et al. · 2020 · 44 citations

Engineering, Computer Engineering, Electrical Engineering +17

Heterogeneous Integration Using Organic Interposer Technology

George Scott, JaeHun Bae, KiYeul Yang et al. · 2020 · 36 citations

Engineering, Computer Engineering, Computer Science +16

Chip Last Fanout Chip on Substrate (FOCoS) Solution for Chiplets Integration

Teck-Chong Lee, Shuhan Yang, Hsin‐Yi Wu et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 2022 · 28 citations

Engineering, Computer Engineering, Electrical Engineering +15

Electrical Design for the Development of FOWLP for HBM Integration

Teck Guan Lim, David Ho Soon Wee · 2018 · 20 citations

Engineering, Electrical Engineering, Microelectronics +16

The Optimal Solution of Fan-Out Embedded Bridge (FO-EB) Package Evaluation during the Process and Reliability Test

Vito Lin, David Lai, Yu-Po Wang · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 2022 · 16 citations

Engineering, Computer Engineering, Packaging Design +16

1–5 of 6

Authors

CF
C. F. Lin
Siliconware Precision Industries (Taiwan), Taiwan
1 publications · 44 citations
1
h-index
KY
KiYeul Yang
Amkor Technology (United States), United States
1 publications · 36 citations
1
h-index
VL
Vito Lin
Siliconware Precision Industries (Taiwan), Taiwan
1 publications · 16 citations
1
h-index
YL
You-Jun Lin
National Taiwan University, Taiwan
1 publications · 28 citations
1
h-index
JJ
Jong-Hyun Jeon
Amkor Technology (United States), United States
1 publications · 36 citations
1
h-index

1–5 of 26

Institutions

1–6 of 6

Venues

2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
Conference · 2 publications · 44 citations
2
h-index

1–1