C. F. Lin

Scalable Chiplet package using Fan-Out Embedded Bridge

Joe Lin, C. Key Chung, C. F. Lin et al. · 2020 · 44 citations

Engineering, Computer Engineering, Electrical Engineering +17

Generational changes of flip chip interconnection technology

Wen Shan Tsai, Chi-Yen Huang, C. Key Chung et al. · 2017 · 31 citations

Engineering, Computer Engineering, Electrical Engineering +17

Assembly and Reliability Challenges for Next Generation High Thermal TIM Materials

Chi-An Pan, Chi-Tung Yeh, Wei-Chun Qiu et al. · 2017 · 17 citations

Engineering, Materials Engineering, Materials Science +17

3D Micro Bump Interface Enabling Top Die Interconnect to True Circuit Through Silicon Via Wafer

Nistec Chang, C. Key Chung, Yu-Po Wang et al. · 2020 · 17 citations

Engineering, Electrical Engineering, High-performance Computing +17