C. Key Chung

Scalable Chiplet package using Fan-Out Embedded Bridge

Joe Lin, C. Key Chung, C. F. Lin et al. · 2020 · 44 citations

Engineering, Computer Engineering, Electrical Engineering +17

Generational changes of flip chip interconnection technology

Wen Shan Tsai, Chi-Yen Huang, C. Key Chung et al. · 2017 · 31 citations

Engineering, Computer Engineering, Electrical Engineering +17

Analysis of Warpage and Stress Behavior in a Fine Pitch Multi-Chip Interconnection with Ultrafine-Line Organic Substrate (2.1D)

Chenyu Huang, Yuan‐Hung Hsu, Ying-Ju Lu et al. · 2018 · 24 citations

Engineering, Materials Science, Microfabrication +16

Electrical Performances of Fan-Out Embedded Bridge

JinWei You, Jay Li, David Ho et al. · 2021 · 19 citations

Engineering, Computer Engineering, Electrical Engineering +17

Assembly and Reliability Challenges for Next Generation High Thermal TIM Materials

Chi-An Pan, Chi-Tung Yeh, Wei-Chun Qiu et al. · 2017 · 17 citations

Engineering, Materials Engineering, Materials Science +17