JaeHun Bae

Publications

Citations

H-Index

2017

Active since

Affiliations

Amkor Technology (United States)(Current)

JaeHun Bae is an author at Amkor Technology (United States) specializing in advanced packaging, microelectronics, and three-dimensional heterogeneous integration.

Top concepts

EngineeringMicroelectronicsAdvanced PackagingComputer EngineeringElectronic PackagingComputer ArchitectureHeterogeneous IntegrationThree-dimensional Heterogeneous IntegrationVlsiTechnology

Publications per year

2017–2020

Publications

Heterogeneous Integration Using Organic Interposer Technology

George Scott, JaeHun Bae, KiYeul Yang et al. · 2020 · 34 citations

Process Integration, Engineering, Device Integration +18

SLIM (TM), High Density Wafer Level Fan-Out Package Development with Submicron RDL

YoungRae Kim, JaeHun Bae, MinHwa Chang et al. · 2017 · 30 citations

Engineering, Computer Architecture, Integrated Circuits +18

Rows per page

1–2 of 2