Etch Uniformity
Etch Uniformity is a metric that quantifies the consistency of material removal across a substrate surface during thin film etching processes, distinguishing itself from other process metrics by its specific focus on spatial variation in etch depth or rate within a single etch step.
173
Publications
6.5K
Citations
622
Authors
175
Institutions
Publications per year
2017–2026
14
173
Bosch deep silicon etching: improving uniformity and etch rate for advanced MEMS applications
G. DeSalvo, Wen Feng Tseng, J. Comas · Journal of The Electrochemical Society · 1992 · 168 citations
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622
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175
Lam Research (United States)
Fremont, United States
5 h-index
15 publications
622 citations
University of Michigan
Ann Arbor, United States
5 h-index
19 publications
382 citations
University of California, Berkeley
Berkeley, United States
5 h-index
12 publications
466 citations

University of Cincinnati
Cincinnati, United States
5 h-index
11 publications
217 citations
AT&T (United States)
Bedminster, United States
5 h-index
21 publications
2.2K citations
University of Illinois Urbana-Champaign
Urbana, United States
4 h-index
9 publications
459 citations
IMEC
Leuven, Belgium
4 h-index
9 publications
193 citations

Kyoto University
Kyoto, Japan
4 h-index
15 publications
281 citations
1–8 of 175
JES · 18 publications · 619 citations
13
h-index
20 publications · 821 citations
13
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18 publications · 968 citations
12
h-index
JJAP · 11 publications · 212 citations
10
h-index
10 publications · 268 citations
10
h-index
1–5