Kari Schjølberg‐Henriksen

Author

Also Known As

K Schjølberg-Henriksen, K. Schjolberg-Henriksen, K. Schjølberg-Henriksen, Kari Schjolberg-Henriksen, Kari Schjo̸lberg-Henriksen, Kari SchjøLberg-Henriksen, Kari Schjølberg-Henriksen, Kari Schjølberg‐Henriksen

Publications

542

Citations

H-Index

Concepts

All Affiliations

SINTEF University of Oslo Sensonor (Norway)

About

Kari Schjølberg‐Henriksen is an author at SINTEF specializing in engineering, materials science, and applied physics.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	11	12	371
2	Applied Physics	8	8	210
3	Education	1	1	23
4	Biomedical Engineering	1	1	15
5	Electrical Engineering	1	1	15

Kari Schjølberg‐Henriksen

Publications

423

Citations

H-Index

Page 1

	Year	Citations
Strong, high-yield and low-temperature thermocompression silicon wafer-level bonding with gold Maaike M. Visser Taklo, Preben Storås, Kari Schjølberg‐Henriksen, Journal of Micromechanics and Microengineering EngineeringMechanical EngineeringSilicon On InsulatorWafer Scale ProcessingAdvanced Packaging (Semiconductors)	2004	95
AlAl thermocompression bonding for wafer-level MEMS sealing Nishant Malik, Kari Schjølberg‐Henriksen, E. Poppe, Sensors and Actuators A Physical Materials EngineeringMaterials ScienceWafer Scale ProcessingEngineeringMicrofabrication	2014	56
Capacitive differential pressure sensor for harsh environments Sigurd Moe, Kari Schjølberg‐Henriksen, D.T Wang, Sensors and Actuators A Physical Harsh EnvironmentsEngineeringSensor InterfaceSensor DesignInstrumentation	2000	55
Wafer-level Au–Au bonding in the 350–450 °C temperature range Hannah Tofteberg, Kari Schjølberg‐Henriksen, Eivind J Fasting, Journal of Micromechanics and Microengineering	2014	34
Anodic bonding of glass to aluminium Kari Schjølberg‐Henriksen, E. Poppe, Sigurd Moe, Microsystem Technologies Materials ScienceMaterials EngineeringGlass-ceramicEngineeringMechanical Engineering	2005	27
Impact of SiO<sub>2</sub>on Al–Al thermocompression wafer bonding Nishant Malik, Kari Schjølberg‐Henriksen, E. Poppe, Journal of Micromechanics and Microengineering Materials EngineeringMaterials ScienceAdvanced PackagingMems DevicesHigh Temperature Materials	2015	24
Sensitive and Selective Photoacoustic Gas Sensor Suitable for High-Volume Manufacturing Kari Schjølberg‐Henriksen, Olaf Schulz, Alain Ferber, IEEE Sensors Journal EngineeringMeasurementGas SensorEducationSensor Technology	2008	23
High-resolution pressure sensor for photo acoustic gas detection Kari Schjølberg‐Henriksen, D.T. Wang, Henrik Rogne, Sensors and Actuators A Physical High-resolution Pressure SensorPhotoelectric SensorSpectroscopyGas SensorInstrumentation	2006	18
Low-Temperature Aluminum-Aluminum Wafer Bonding Bernhard Rebhan, Andreas Hinterreiter, Nishant Malik, ECS Transactions Materials ScienceMaterials EngineeringAluminium NitrideMaterial AnalysisEngineering	2016	17
Anodic bonding for monolithically integrated MEMS Kari Schjølberg‐Henriksen, Geir Uri Jensen, A. Hanneborg, Sensors and Actuators A Physical Wafer Scale ProcessingEngineeringDevice IntegrationMicrofabricationApplied Physics	2004	16

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