Kari Schjølberg‐Henriksen

Strong, high-yield and low-temperature thermocompression silicon wafer-level bonding with gold

Maaike M. Visser Taklo, Preben Storås, Kari Schjølberg‐Henriksen et al. · Journal of Micromechanics and Microengineering · 2004 · 95 citations

Engineering, Mechanical Engineering, Silicon On Insulator +21

AlAl thermocompression bonding for wafer-level MEMS sealing

Nishant Malik, Kari Schjølberg‐Henriksen, E. Poppe et al. · Sensors and Actuators A Physical · 2014 · 56 citations

Materials Engineering, Materials Science, Wafer Scale Processing +9

Capacitive differential pressure sensor for harsh environments

Sigurd Moe, Kari Schjølberg‐Henriksen, D.T Wang et al. · Sensors and Actuators A Physical · 2000 · 55 citations

Harsh Environments, Engineering, Sensor Interface +3

Wafer-level Au–Au bonding in the 350–450 °C temperature range

Hannah Tofteberg, Kari Schjølberg‐Henriksen, Eivind J Fasting et al. · Journal of Micromechanics and Microengineering · 2014 · 34 citations · Full text

Anodic bonding of glass to aluminium

Kari Schjølberg‐Henriksen, E. Poppe, Sigurd Moe et al. · Microsystem Technologies · 2005 · 27 citations

Materials Science, Materials Engineering, Glass-ceramic +6