Maaike M. Visser Taklo

Strong, high-yield and low-temperature thermocompression silicon wafer-level bonding with gold

Maaike M. Visser Taklo, Preben Storås, Kari Schjølberg‐Henriksen et al. · Journal of Micromechanics and Microengineering · 2004 · 95 citations

Engineering, Mechanical Engineering, Silicon On Insulator +21

3D Integration technology: Status and application development

Peter Ramm, Armin Klumpp, Josef Weber et al. · 2010 · 80 citations · Full text

Engineering, Device Integration, 3D Modeling +25

3D System-on-Chip technologies for More than Moore systems

Peter Ramm, Armin Klumpp, Josef Weber et al. · Microsystem Technologies · 2009 · 62 citations

System On Chip, 3D Ic Architecture, Engineering +6

AlAl thermocompression bonding for wafer-level MEMS sealing

Nishant Malik, Kari Schjølberg‐Henriksen, E. Poppe et al. · Sensors and Actuators A Physical · 2014 · 56 citations

Materials Engineering, Materials Science, Wafer Scale Processing +9

Design, process and characterisation of a high-performance vibration sensor for wireless condition monitoring

Andreas Vogl, Dag T. Wang, Preben Storås et al. · Sensors and Actuators A Physical · 2009 · 48 citations

Condition Monitoring, Wireless Condition Monitoring, Engineering +12