Maaike M. Visser Taklo

Author

Also Known As

Dr. Maaike M. V. Taklo, M M V Taklo, M. M. V. Taklo, M. Taklo, M.M. Visser Taklo, M.M.V. Taklo, M.M.Visser Taklo, Maaike M V Taklo, Maaike M. V. Taklo, Maaike M. Visser Taklo

Publications

774

Citations

H-Index

Concepts

All Affiliations

SINTEF Intrinsiq Materials (United Kingdom)Chemnitz University of Technology University of Oslo Fraunhofer Research Institution for Microsystems and Solid State Technologies

About

Maaike M. Visser Taklo is an author at SINTEF specializing in engineering, microelectronics, and electronic packaging.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	13	14	570
2	Applied Physics	8	8	284
3	Electrical Engineering	5	5	188
4	Natural Sciences	1	1	80
5	Computer Engineering	1	1	62

Maaike M. Visser Taklo

Publications

604

Citations

H-Index

Page 1

	Year	Citations
Strong, high-yield and low-temperature thermocompression silicon wafer-level bonding with gold Maaike M. Visser Taklo, Preben Storås, Kari Schjølberg‐Henriksen, Journal of Micromechanics and Microengineering EngineeringMechanical EngineeringSilicon On InsulatorWafer Scale ProcessingAdvanced Packaging (Semiconductors)	2004	95
3D Integration technology: Status and application development Peter Ramm, Armin Klumpp, Josef Weber, EngineeringDevice Integration3D ModelingItrs RoadmapComputer-aided Design	2010	80
3D System-on-Chip technologies for More than Moore systems Peter Ramm, Armin Klumpp, Josef Weber, Microsystem Technologies System On Chip3D Ic ArchitectureEngineeringComputer DesignComputer Architecture	2009	62
AlAl thermocompression bonding for wafer-level MEMS sealing Nishant Malik, Kari Schjølberg‐Henriksen, E. Poppe, Sensors and Actuators A Physical Materials EngineeringMaterials ScienceWafer Scale ProcessingEngineeringMicrofabrication	2014	56
Design, process and characterisation of a high-performance vibration sensor for wireless condition monitoring Andreas Vogl, Dag T. Wang, Preben Storås, Sensors and Actuators A Physical Condition MonitoringWireless Condition MonitoringEngineeringMechanical EngineeringVibration Measurement	2009	48
Nanoparticle assembly and sintering towards all-copper flip chip interconnects Jonas Zürcher, Kerry Yu, Gerd Schlottig, Nanoparticle AssemblyEngineeringCu Pillar ChipIntegrated CircuitsInterconnect (Integrated Circuits)	2015	41
Au-Sn SLID Bonding: A Reliable HT Interconnect and Die Attach Technology Torleif A. Tollefsen, Andreas Larsson, Maaike M. Visser Taklo, Metallurgical and Materials Transactions B Materials EngineeringMaterials ScienceAu-sn Slid BondingEngineeringAdvanced Packaging (Semiconductors)	2013	41
Wafer-level Au–Au bonding in the 350–450 °C temperature range Hannah Tofteberg, Kari Schjølberg‐Henriksen, Eivind J Fasting, Journal of Micromechanics and Microengineering	2014	34
Characterization and Failure Analysis of 3D Integrated Systems using a novel plasma-FIB system Laurens Kwakman, German Franz, Maaike M. Visser Taklo, AIP conference proceedings EngineeringPlasma PhysicsPlasma ProcessingPlasma ElectronicsPlasma Simulation	2011	32
Anodic bonding of glass to aluminium Kari Schjølberg‐Henriksen, E. Poppe, Sigurd Moe, Microsystem Technologies Materials ScienceMaterials EngineeringGlass-ceramicEngineeringMechanical Engineering	2005	27

Page 1