AlAl thermocompression bonding for wafer-level MEMS sealing - Concepedia

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AlAl thermocompression bonding for wafer-level MEMS sealing

56

Citations

13

References

2014

Year

Nishant Malik, Kari Schjølberg‐Henriksen, E. Poppe, Maaike M. Visser Taklo, T. G. Finstad

Sensors and Actuators A Physical

Materials EngineeringMaterials ScienceWafer Scale ProcessingEngineeringMicrofabricationMechanical EngineeringSealantChip AttachmentThermodynamicsElectronic PackagingMicroelectronicsAlal Thermocompression

References

	Year	Citations

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