Concepedia

Nishant Malik

NM

4

Publications

108

Citations

4

H-Index

2014

Active since

Affiliations

University of Oslo(Current)

SINTEF

Nishant Malik is an author at University of Oslo specializing in materials science, electronic packaging, and materials engineering.

Top concepts

EngineeringMaterial ScienceElectronic PackagingMaterials EngineeringApplied PhysicsMicroelectronicsMicrofabricationMechanical EngineeringThin FilmsMicrostructure

Publications per year

2014–2017

4

Publications

4

AlAl thermocompression bonding for wafer-level MEMS sealing

Nishant Malik, Kari Schjølberg‐Henriksen, E. Poppe et al. · Sensors and Actuators A Physical · 2014 · 56 citations

Materials Engineering, Materials Science, Wafer Scale Processing +9

Impact of SiO<sub>2</sub>on Al–Al thermocompression wafer bonding

Nishant Malik, Kari Schjølberg‐Henriksen, E. Poppe et al. · Journal of Micromechanics and Microengineering · 2015 · 24 citations

Materials Engineering, Materials Science, Advanced Packaging +14

Low-Temperature Aluminum-Aluminum Wafer Bonding

Bernhard Rebhan, Andreas Hinterreiter, Nishant Malik et al. · ECS Transactions · 2016 · 17 citations · Full text

Materials Science, Materials Engineering, Aluminium Nitride +12

Characterization of interfacial morphology of low temperature, low pressure Au–Au thermocompression bonding

Mark S. Goorsky, Kari Schjølberg‐Henriksen, Brett Beekley et al. · Japanese Journal of Applied Physics · 2017 · 11 citations

Engineering, Surface Nanotechnology, Thin Film Process Technology +20

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