E. Poppe - Concepedia

Author

E. Poppe

SINTEF ORCID

Also Known As

E Poppe, E. Poppe, Erik Poppe, Erik U Poppe

Publications

322

Citations

H-Index

Concepts

All Affiliations

SINTEF University of Oslo Norwegian University of Science and Technology University of New Mexico

About

E. Poppe is an author at SINTEF specializing in engineering, materials science, and applied physics.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	6	6	159
2	Applied Physics	4	4	76
3	Electrical Engineering	2	2	34
4	Biomedical Engineering	1	1	15
5	Chemistry	1	1	18

E. Poppe

Publications

264

Citations

H-Index

Page 1

	Year	Citations
AlAl thermocompression bonding for wafer-level MEMS sealing Nishant Malik, Kari Schjølberg‐Henriksen, E. Poppe, Sensors and Actuators A Physical Materials EngineeringMaterials ScienceWafer Scale ProcessingEngineeringMicrofabrication	2014	56
High-power (400 mW) diode-pumped 2.7 µm Er:ZBLANfibre lasers usingenhanced Er-Er cross-relaxation processes Balaji Srinivasan, E. Poppe, Jason Tafoya, Electronics Letters	1999	46
Wafer-level Au–Au bonding in the 350–450 °C temperature range Hannah Tofteberg, Kari Schjølberg‐Henriksen, Eivind J Fasting, Journal of Micromechanics and Microengineering	2014	34
Anodic bonding of glass to aluminium Kari Schjølberg‐Henriksen, E. Poppe, Sigurd Moe, Microsystem Technologies Materials ScienceMaterials EngineeringGlass-ceramicEngineeringMechanical Engineering	2005	27
980 nm diode-pumped continuous wave mid-IR (2.7µm) fibre laser E. Poppe, Balaji Srinivasan, R. K. Jain Electronics Letters	1998	25
Impact of SiO<sub>2</sub>on Al–Al thermocompression wafer bonding Nishant Malik, Kari Schjølberg‐Henriksen, E. Poppe, Journal of Micromechanics and Microengineering Materials EngineeringMaterials ScienceAdvanced PackagingMems DevicesHigh Temperature Materials	2015	24
Tuning of resist slope with hard-baking parameters and release methods of extra hard photoresist for RF MEMS switches Shimul C. Saha, Håkon Sagberg, E. Poppe, Sensors and Actuators A Physical Electrical EngineeringPhotoelectric SensorEngineeringExtra Hard PhotoresistElectron-beam Lithography	2007	19
Interfacial characterization of Al-Al thermocompression bonds N. Malik, P.A. Carvalho, E. Poppe, Journal of Applied Physics Materials ScienceAluminium NitrideWafer Scale ProcessingEngineeringCrystalline Defects	2016	18
Fabrication process for CMUT arrays with polysilicon electrodes, nanometre precision cavity gaps and through-silicon vias J. Due-Hansen, E. Poppe, Anand Summanwar, Journal of Micromechanics and Microengineering EngineeringBiomedical EngineeringIntegrated CircuitsSilicon On InsulatorSensor Technology	2012	15

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