Sensonor (Norway)

Packaging Effect on MEMS Pressure Sensor Performance

Rudolf H. Krondorfer, Yeong K. Kim · IEEE Transactions on Components and Packaging Technologies · 2007 · 70 citations

Materials Science, Mems Sensor, Engineering +14

Boron etch-stop in TMAH solutions

E. Steinsland, Martin Nese, A. Hanneborg et al. · Sensors and Actuators A Physical · 1996 · 49 citations

Boron Nitride, Physics, Tmah Solutions +2

Finite element simulation of package stress in transfer molded MEMS pressure sensors

Rudolf H. Krondorfer, Yeong K. Kim, Jaeok Kim et al. · Microelectronics Reliability · 2004 · 48 citations

Materials Science, Engineering, Finite Element Simulation +13

An electrostatic energy harvester with electret bias

Einar Halvorsen, Eskild R. Westby, Svein Husa et al. · TRANSDUCERS 2009 - 2009 International Solid-State Sensors, Actuators and Microsystems Conference · 2009 · 43 citations

Engineering, Energy Conversion, Microelectromechanical Systems +17

CMOS-Integrated Si/SiGe Quantum-Well Infrared Microbolometer Focal Plane Arrays Manufactured With Very Large-Scale Heterogeneous 3-D Integration

Fredrik Forsberg, Adriana Lapadatu, Gjermund Kittilsland et al. · IEEE Journal of Selected Topics in Quantum Electronics · 2014 · 42 citations · Full text

Engineering, Device Integration, Integrated Photonics +21