Concepedia
Statistics
Publications
5
Citations
209
H-Index
Active since
2002
Affiliations
Northwestern University(Current)
Sensonor (Norway)
Hanwha Techwin (South Korea)
Georgia Institute of Technology
Yeong K. Kim is an author at Northwestern University specializing in materials science, materials engineering, and composite materials.
Publications per year
2002–2007
Packaging Effect on MEMS Pressure Sensor Performance
Rudolf H. Krondorfer, Yeong K. Kim · IEEE Transactions on Components and Packaging Technologies · 2007 · 71 citations
Engineering, Materials Engineering, Materials Science +17
Finite element simulation of package stress in transfer molded MEMS pressure sensors
Rudolf H. Krondorfer, Yeong K. Kim, Jaeok Kim et al. · Microelectronics Reliability · 2004 · 48 citations
Engineering, Electrical Engineering, Mechanical Engineering +16
Cure Cycle Effect on Composite Structures Manufactured by Resin Transfer Molding
Yeong K. Kim, Isaac M. Daniel · Journal of Composite Materials · 2002 · 41 citations
Natural Sciences, Materials Engineering, Materials Science +17
Laser Ultrasonic Array System for Real-Time Cure Monitoring of Polymer-Matrix Composites
Pavel A. Fomitchov, Yeong K. Kim, Alexei K. Kromine et al. · Journal of Composite Materials · 2002 · 25 citations
Process-Induced Residual Stress Analysis by Resin Transfer Molding
Yeong K. Kim · Journal of Composite Materials · 2004 · 24 citations
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