Microelectronics Reliability · 2004 · 48 citations · 11 references
Materials ScienceEngineeringFinite Element SimulationMicrofabricationMechanical BehaviorMechanicsMechanical EngineeringStressstrain AnalysisPackage StressSolid MechanicsMems Pressure SensorsElectronic PackagingPressure VesselMicroelectronicsMechanics Of MaterialsMicro-electromechanical System
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Challenges in the packaging of MEMS
Chad B. O’Neal, Ajay P. Malshe, Sushila Singh et al. · 2003 · 97 citations · Full text